Unclassified

Results: 266
Select Image Part # Mfr. Description Datasheet Availability Pricing (GBP) Filter the results in the table by unit price based on your quantity. Qty. RoHS
NXP Semiconductors MBMI7318TANAE
NXP Semiconductors NXP Semiconductors 18 Cells Analog Front End IC with TPL Interface for Energy Storage System - Tray Non-Stocked Lead-Time 39 Weeks
Min.: 1
Mult.: 1

Murrelektronik 4186-68522-0000001
Murrelektronik Murrelektronik MODLINK MSDD FRONT PANEL INTERFACE, Frame modul double transparent, Closure with rotation knob, DMG ID:2847977 Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 676221
Murrelektronik Murrelektronik PANEL INTERFACE, MSDD, MET, DOUB, GRAY, RJ 45/45:8p.fem.shield., 1,5m cable, VDE with LED, screw term.M4 Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 676214
Murrelektronik Murrelektronik PANEL INTERFACE, MSDD, MET, SING., SubD:25p.fem.(AWG20, UNC4-40, EN)sold.back, RJ 45/45 fem.shield., IP64, alt 4000-68113-1470000 Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 676339
Murrelektronik Murrelektronik PANEL INTERFACE, MSDD, MET, DOUB, GRAY, SubD:9fe/fe(UNC, EN)+RJ45fe.+BNCfe.(RG59/62), UTE (NFC 61-314) with LED, alt 4000-68123-1810050 Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 676361
Murrelektronik Murrelektronik PANEL INTERFACE, MSDD, MET, SING, GRAY, 9 pole fem/ma + RJ45/45fe + RJ12/12fe., Discontinued, alt 4000-68113-1120000 Non-Stocked
Min.: 1
Mult.: 1
IBASE IDA-8104
IBASE IBASE Technology Inc. PoE+ PSE Expansion card for EC3100, IEEE 802.3 at PoE+ PSE, Each port support PD 25.5W,SUMIT interface connector Non-Stocked
Min.: 1
Mult.: 1
NXP Semiconductors MBMI7318TANAER2
NXP Semiconductors NXP Semiconductors 18 Cells Analog Front End IC with TPL Interface for Energy Storage System - Tray Non-Stocked Lead-Time 39 Weeks
Min.: 1,500
Mult.: 1,500
: 1,500

Murrelektronik 596072
Murrelektronik Murrelektronik PHASE-OUT TYPE SYST. WIRING MIS, MISP - 16 AI/AO, Passive interface module, screw terminal, clearance sale possible Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 676172
Murrelektronik Murrelektronik PANEL INTERFACE, MSDD, MET, SING, GRAY, 2xSubD:9p.fem, 25p.ma, AWG20, UNC4-40, Soldering cups fr.back, alt 4000-68113-0410000 Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 676256
Murrelektronik Murrelektronik PANEL INTERFACE, MSDD, MET, SING, GRAY, RJ45/45, 9-p. blind, Plug in from both sides, alt 4000-68113-1210000 Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 676300
Murrelektronik Murrelektronik PANEL INTERFACE, MSDD, MET, DOUB., 2 x 25 pole fem. + british socket (BS 1363), Discontinued, replaced by 4000-68123-0710060 Non-Stocked
Min.: 1
Mult.: 1
Murrelektronik 4186-68522-4300001
Murrelektronik Murrelektronik MODLINK MSDD FRONT PANEL INTERFACE, Frame modul double transparent, Mounting frame equipped with VDE plug socket and EMC shield plate, DMG ID:2762400 Non-Stocked
Min.: 1
Mult.: 1
congatec CONGA-HPC/CBLS-5-211E
congatec congatec COM-HPC Client module based on Intel Core 5 Processor 211E with 6P-cores 2.7GHz up to 4.9GHz Turbo and 4 E-cores 2.0GHz up to 3.7GHz Turbo 20MB Intel Smart Cache Intel UHD Graphics 770 with 24EUs Dual channelDDR5 memory interface Chipset R Non-Stocked
Min.: 1
Mult.: 1
congatec CONGA-HPC/CBLS-7-251E
congatec congatec COM-HPC Client module based on Intel Core 7 Processor 251E with 8P-cores 2.1GHz up to 5.6GHz Turbo and 16 E-cores 1.6GHz up to 4.4 GHz Turbo 36MB Intel Smart Cache Intel UHD Graphics 770 with 32EUs Dual channelDDR5 memory interface Chipset Non-Stocked
Min.: 1
Mult.: 1
Telit Cinterion 3990150799
Telit Cinterion Telit Cinterion Kit contains: Sandbox EVB 3990150785, FE910C04-WW INTERFACE SMALL TLB 3990252669, WE310K6-P M.2; -FE910C04 SANDBOX ETHERNET BOARD (3990150789) -5G/4G ANTENNAS TG.55.8113W, 2EA -PWR SUPPLY 1JJ0400056TNP (R032172L-N), 1EA -USB CABLE 3.0-A TO USB 3.0-C
Non-Stocked
Min.: 1
Mult.: 1
congatec CONGA-HPC/CBLS-3-201E
congatec congatec COM-HPC Client module based on Intel Core 3 Processor 201E with 4P-cores 3.6GHz up to 4.8GHz Turbo 12MB Intel Smart Cache Intel UHD Graphics770 with 24EUs Dual channel DDR5 memory interface Chipset Q670E Intel code name: Bartlett Lake S Non-Stocked
Min.: 1
Mult.: 1
congatec CONGA-HPC/CRLP-U300E
congatec congatec COM-HPC Size A module based on Intel Processor U300E with 1 P-core 1.1GHz up to 4.3GHz Turbo and 4 E-cores 0.9GHz up to 3.2GHz Turbo 8MB Intel Smart Cache Intel UHD Graphics with 48 EUs Dual channel DDR5 5200 MT/s memory interface Intel c Non-Stocked
Min.: 1
Mult.: 1
MakerBot 80-165733
MakerBot UltiMaker Interface PCB (MS)
OmniOn Power OmniOn Power 2800W, DC/DC 48Vin 12.3Vout , 12Vsb, PMBus interface Non-Stocked Lead-Time 26 Weeks
Min.: 5
Mult.: 5

OmniOn Power OmniOn Power 2800W, 12.3Vout , 12Vsb, PMBus interface, Titanium Efficiency Non-Stocked Lead-Time 26 Weeks
Min.: 1
Mult.: 1

SECO SECO 3.5 Qseven 2.1 Carrier board for Q7 modules with HDMI & LVDS interfaces, 2x GbE Non-Stocked Lead-Time 22 Weeks
Min.: 100
Mult.: 100

SECO SECO 3.5 Qseven 2.1 Carrier board for Q7 modules with DP++ & eDP display interfaces, 2x GbE Non-Stocked Lead-Time 22 Weeks
Min.: 100
Mult.: 100

MakerBot 228394
MakerBot UltiMaker Interface Cable Material Handling (F Series)
MakerBot 70-227531
MakerBot UltiMaker User Interface Assembly (F Series)