SP400-0.007-AC-38

Bergquist Company
951-SP400-0.007-AC38
SP400-0.007-AC-38

Mfr.:

Description:
Thermal Interface Products Sil-Pad, 0.007" Thickness, 1 Side Adhesive, Sil-Pad TSP900/400, 3223-07AC-38
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Availability

Stock:
Factory Drop Ship
Minimum: 727   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£0.918 £667.39
£0.867 £867.00
£0.819 £2,047.50

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Non-standard
Silicone Elastomer
3.5 kVAC
Gray
- 60 C
+ 180 C
0.007 in
20 MPa
UL 94 V-0
400 / TSP 900
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Thermal Interface Products
Factory Pack Quantity: 1
Subcategory: Thermal Management
Tradename: Sil-Pad
Part # Aliases: L2.5INW0.75INH0.007AC BG106702 2188803
Unit Weight: 617 mg
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Attributes selected: 0 

                        
Shelf Life on this Product: Silicone Adhesives: Six (6) months from date of manufacture when stored in original packaging at 70 Degrees Farhenheit (21 Degrees Celsius) and 50 percent relative humidity.
Please contact a Mouser Technical Service Representative for further assistance.
5-1120-5

USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

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