sensors Sensor Interface

Results: 784
Select Image Part # Mfr. Description Datasheet Availability Pricing (GBP) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Interface Type Supply Voltage - Max Supply Voltage - Min Operating Supply Current Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package/Case ESD Protection Qualification Packaging
Renesas Electronics ZSSC3224BI5B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 15,573
Mult.: 15,573

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4132CE5R
Renesas Electronics Sensor Interface TSSOP16 Non-Stocked Lead-Time 24 Weeks
Min.: 4,000
Mult.: 4,000
: 4,000

SMD/SMT TSSOP-16 Reel
Renesas Electronics ZSSC4161DE1B-APB
Renesas Electronics Sensor Interface TESTED WAFER -CFG 4161_0500_03 V2.2 Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4161DE1C-APB
Renesas Electronics Sensor Interface TESTED DIE, SAWN ON FOIL -CFG 4161_0500_ Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Tray

Renesas Electronics Sensor Interface Sensor Signal Conditoner Non-Stocked Lead-Time 24 Weeks
Min.: 660
Mult.: 660

Automotive I2C 16.5 V 8.2 V 7 mA - 40 C + 125 C SMD/SMT SSOP-20 With ESD Protection AEC-Q100 Tube

Renesas Electronics Sensor Interface Sensor Signal Conditoner Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Automotive I2C 16.5 V 8.2 V 7 mA - 40 C + 150 C SMD/SMT SSOP-20 With ESD Protection AEC-Q100 Tube
Renesas Electronics ZSC31150GED
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC3218BI1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 17,000
Mult.: 17,000

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4151CE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 4,347
Mult.: 4,347

SMD/SMT Die Tray
Renesas Electronics ZSSC3286CI5C
Renesas Electronics Sensor Interface DICE ON FRAME ON 304 MICRO METER WAFER W Non-Stocked Lead-Time 19 Weeks
Min.: 1
Mult.: 1

I2C, UART 5.5 V 1.8 V 8 mA - 40 C + 125 C SMD/SMT
Silicon Labs Sensor Interface I2C proximity/ambient light sensor with 2 LED drivers, AEC-Q100 Non-Stocked
Min.: 2,500
Mult.: 2,500
: 2,500

3.6 V 1.71 V 4.3 mA - 40 C + 85 C SMD/SMT QFN-10 AEC-Q100 Reel
Renesas Electronics ZSSC3230BC5B
Renesas Electronics Sensor Interface WAFER UNSAWN, 304U, WITH INKING Non-Stocked Lead-Time 18 Weeks
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3018BA2C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 16,000
Mult.: 16,000

Sensor Signal Conditioner I2C/SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die Tray
Renesas Electronics ZSSC3123AI3B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - WAFER BOX Non-Stocked Lead-Time 18 Weeks
Min.: 9,000
Mult.: 9,000

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3123AI6C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 9,464
Mult.: 9,464

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Tray
Silicon Labs Sensor Interface Non-Stocked
Min.: 1
Mult.: 1
3.6 V 1.62 V 4.5 mA - 40 C + 85 C SMD/SMT DFN-10 AEC-Q100
Silicon Labs Sensor Interface Non-Stocked
Min.: 2,500
Mult.: 1

3.6 V 1.62 V 4.5 mA - 40 C + 85 C SMD/SMT DFN-10 AEC-Q100
Renesas Electronics ZSC31050FAB
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 2,900
Mult.: 2,900

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4151CE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC3286CI1B
Renesas Electronics Sensor Interface DICE ON 304 MICRO METER WAFER NO INKING Non-Stocked Lead-Time 25 Weeks
Min.: 2,092
Mult.: 2,092

I2C, UART 5.5 V 1.8 V 8 mA - 40 C + 125 C SMD/SMT
Renesas Electronics ZSSC3286CI5B
Renesas Electronics Sensor Interface DICE ON 304 MICRO METER WAFER WITH INKIN Non-Stocked Lead-Time 19 Weeks
Min.: 2,092
Mult.: 2,092

I2C, UART 5.5 V 1.8 V 8 mA - 40 C + 125 C SMD/SMT
Renesas Electronics ZSSC3224BI1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 16,500
Mult.: 16,500

Sensor Signal Conditioner I2C, SPI 3.6 V 1.68 V 1 mA - 40 C + 85 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3154BE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
ScioSense TDC-GP30YD-F01 1K
ScioSense Sensor Interface Ultrasonic flow converter with CPU & flow firmware in QFN32 Non-Stocked
Min.: 1,000
Mult.: 1,000
: 1,000

SMD/SMT QFN-32 Reel
Renesas Electronics ZSSC3138BE1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2,880
Mult.: 2,880

SMD/SMT Die Gel Pack