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TT60N16SOF

Name: Infineon TT60N16SOF
Brand: Infineon Technologies
SKU: 641-TT60N16SOF
Price: 23.68 GBP
Availability: InStock

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Mouser No:

641-TT60N16SOF

Mfr. No:

TT60N16SOF

Mfr.:

Infineon Technologies

Description:

Thyristor Modules 20mm Solder Bond Thyristor Module

Datasheet:

TT60N16SOF Datasheet (PDF)

ECAD Model:

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Learn more about Infineon Technologies TT60N16SOF

In Stock: 30

Stock:: 30 Can Dispatch Immediately

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Factory Lead Time:: 30 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (GBP)

Qty.	Unit Price	Ext. Price
	£23.68	£23.68
	£20.20	£242.40
	£17.66	£1,907.28
25,008	Quote

Alternative Packaging

Mfr. Part No.:

TT60N16SOFHPSA1

Packaging:

Tray

Availability:

In Stock

Price:

£21.01

Min:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	Thyristor Modules
RoHS:
Gate Trigger Current - Igt:	100 mA
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Mounting Style:	Screw Mount
Packaging:	Tray
Brand:	Infineon Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	DE
Holding Current Ih Max:	250 mA
Product Type:	Thyristor Modules
Factory Pack Quantity:	12
Subcategory:	Discrete and Power Modules
Technology:	Si
Part # Aliases:	SP001272792 TT60N16SOFHPSA1
Unit Weight:	75 g

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Datasheet

TT60N16SOF Datasheet (PDF)

Product Catalogs

Infineon's Latest Power and Sensing Guide (PDF)

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CNHTS:: 8541300000
CAHTS:: 8541300000
USHTS:: 8541300080
JPHTS:: 854130000
TARIC:: 8541300000
ECCN:: EAR99

Solder Bond Power Block IGBT Modules

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These Power Block modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder Power Block modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.