CL21B472KC6WPNC

Samsung Electro-Mechanics
187-CL21B472KC6WPNC
CL21B472KC6WPNC

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT Automotive grade 0805 X7R 4.7nF 100V

ECAD Model:
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In Stock: 152,285

Stock:
152,285
Can Dispatch Immediately
On Order:
68,000
Factory Lead Time:
24
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (GBP)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
£0.197 £0.20
£0.117 £1.17
£0.071 £7.10
£0.055 £27.50
£0.05 £50.00
£0.045 £90.00
Full Reel (Order in multiples of 4000)
£0.041 £164.00
† A MouseReel™ fee of £3.50 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Product Attribute Attribute Value Select Attribute
Samsung Electro-Mechanics
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
4700 pF
100 VDC
X7R
10 %
0805
2012
SMD/SMT
Conductive Epoxy
- 55 C
+ 125 C
2 mm (0.079 in)
1.25 mm (0.049 in)
0.6 mm (0.024 in)
Automotive MLCCs
AEC-Q200
CL Automotive
Reel
Cut Tape
MouseReel
Brand: Samsung Electro-Mechanics
Class: Class 2
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: KR
Package/Case: 0805 (2012 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 4000
Subcategory: Capacitors
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CNHTS:
8532241000
USHTS:
8532240020
JPHTS:
853224000
TARIC:
8532240000
BRHTS:
85322410
ECCN:
EAR99

CL Normal Capacitance Automotive MLCCs

Samsung Electro-Mechanics CL Normal Capacitance Automotive MLCCs are AEC-Q200 qualified and offer normal capacitances in small sizes. The designers/users can implement the desired composition in a small space with high capacitances ranging from 470nF to 2.2µF with a ±10% tolerance. These small-sized components feature an X7R temperature characteristic with a -55°C to +125°C temperature range and a 25VDC to 35VDC rated voltage range. The automotive CL normal capacitance MLCCs allow dense component placement near ADAS SoCs without issues.