2007263-1

TE Connectivity
571-2007263-1
2007263-1

Mfr.:

Description:
I/O Connectors Cage 1x2 EMI Shield w/Springs

ECAD Model:
Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 1,095

Stock:
1,095 Can Dispatch Immediately
Factory Lead Time:
10 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£6.77 £6.77
£6.34 £63.40
£6.15 £184.50
£6.03 £361.80
£5.86 £703.20
£5.53 £1,493.10

Product Attribute Attribute Value Select Attribute
TE Connectivity
Product Category: I/O Connectors
RoHS:  
Cages
Through Hole
Press Fit
Right Angle
SFP
- 55 C
+ 105 C
Tray
Brand: TE Connectivity
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Features: SFP Ganged 1 x 2
Housing Material: Nickel Silver
Number of Ports: 2 Port
Product Type: I/O Connectors
Factory Pack Quantity: 30
Subcategory: I/O Connectors
Type: SFP
Unit Weight: 12.261 g
Products found:
To show similar products, select at least one checkbox
Select at least one checkbox above to show similar products in this category.
Attributes selected: 0

CNHTS:
8538900000
TARIC:
8517700000
CAHTS:
8538909090
USHTS:
8538908180
JPHTS:
853890000
BRHTS:
85389090
ECCN:
EAR99

TE Connectivity SFP+ I/O

TE Connectivity's SFP+ product family extends the use of the Small Form-Factor Pluggable (SFP) interconnect up to 10Gb/s. This system meets the performance requirements of SFF (Small Form-Factor) specification SFF-8431 and supports 8G Fiber Channel and 10G Ethernet applications. The SFP+ product family includes cages, connectors, and copper cable assemblies.
Learn More

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.