JSO-0700-01

Samtec
200-JSO-0700-01
JSO-0700-01

Mfr.:

Description:
Standoffs & Spacers SureWare Jack Screw Precision Board Stacking Standoff

Datasheet:
ECAD Model:
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Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£5.98 £5.98
£5.19 £129.75
£4.39 £219.50
£3.19 £319.00
£3.16 £1,580.00

Product Attribute Attribute Value Select Attribute
Samtec
Product Category: Standoffs & Spacers
RoHS:  
Standoffs
Round
Stainless Steel
Bulk
Brand: Samtec
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Product Type: Standoffs, Spacers & Supports
Series: JSO
Factory Pack Quantity: 1
Subcategory: Hardware
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Attributes selected: 0

Datasheet

Technical Resources

USHTS:
7318190000
ECCN:
EAR99

5G Solutions

Samtec 5G Solutions support the ultra-high frequencies and high data rates that emerging 5G technologies demand. As this 5G network quickly gains momentum, new systems, devices, and equipment are needed for technologies such as mmWave, Massive MIMO, beamforming, and full-duplex (FDX). Samtec 5G Solutions feature high-performance products for four applications: Test and Development Systems, Remote Radio and Active Antennas, Network Equipment, and Automotive and Transportation.

.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

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