B1SDS-10-N-CS

Samtec
200-B1SDS-10-N-CS
B1SDS-10-N-CS

Mfr.:

Description:
I/O Connectors URSA(TM) I/O Metal Shell for Cable Socket Housing

Lifecycle:
New Product:
New from this manufacturer.
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Product Attribute Attribute Value Select Attribute
Samtec
Product Category: I/O Connectors
Delivery Restriction:
 Mouser does not presently sell this product in your region.
I/O Connectors
10 Position
1 mm
253 VAC
Gold
PCB Mount
Cable
Vertical
B1SDS
- 40 C
+ 125 C
Bag
Brand: Samtec
Contact Material: Beryllium Copper
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Current Rating: 3.8 A
Housing Material: Zinc
Insulation Material: Liquid Crystal Polymer (LCP)
Product Type: I/O Connectors
Factory Pack Quantity: 1
Subcategory: I/O Connectors
Tradename: URSA
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USHTS:
8538908180
JPHTS:
853890000
ECCN:
EAR99

B1SDS I/O Metal Shell for Cable Socket Housings

Samtec B1SDS I/O Metal Shell for Cable Socket Housings are ideal for use with IBT1 cable socket housing and CC508 crimp contact. These housings include captive screws for cable-to-cable and cable-to-board applications. The EMI shielding limits signal degradation and optimizes performance. The B1SDS I/O housings come with a zinc alloy as shielding material, beryllium copper as contact material, and liquid crystal polymer as insulator material.

URSA® Ultra Rugged I/O System

Samtec URSA® Ultra Rugged I/O System features a hyperboloid-type contact for maximum reliability and high mating cycles. This cable-to-cable and cable-to-board solution achieves four points of contact to create a reliable connection in a small form factor. This design results in extreme density with up to 1450 total I/Os in a single 1RU panel (29 cables at 50 total I/Os each). The system also provides EMI shielding to minimize signal degradation while optimizing performance. Samtec URSA Ultra Rugged I/O System comprises a full range of products, including cable assemblies, connectors, housings, crimp contacts, and crimp terminals. The URSA lineup is ideal for military and aerospace applications, submersibles, and harsh environments.