87715-9302

Molex
538-87715-9302
87715-9302

Mfr.:

Description:
PCI Express/PCI Connectors 1.00MM 164P .062" 15AU

Datasheet:
ECAD Model:
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Learn more about Molex 87715-9302

In Stock: 609

Stock:
609 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£5.56 £5.56
£4.73 £47.30
£4.43 £110.75
£4.22 £211.00
£4.02 £402.00
£3.77 £942.50
£3.58 £1,790.00

Product Attribute Attribute Value Select Attribute
Molex
Product Category: PCI Express/PCI Connectors
RoHS:  
PCI Express
164 Position
Through Hole
Vertical
Through Hole
Tin
Gold
87715
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 1.1 A
Housing Material: Thermoplastic
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Packaging: Tray
Product Type: PCI Express / PCI Connectors
Factory Pack Quantity: 630
Subcategory: Card Edge Connectors
Voltage Rating: 50 VAC/DC
Part # Aliases: 0877159302
Unit Weight: 8.693 g
Products found:
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Attributes selected: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

PCI Express Edgecard Connectors

Molex PCI Express Edgecard Connectors offer a third-generation I/O architecture. PCI-SIG revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5GT/s (gigatransfer per second) to 5GT/s per lane. PCI Express supports high-bandwidth applications and is also backward compatible with PCI Express 1.1 version products.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

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