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215922-1401

Name: Molex 215922-1401
Brand: Molex
SKU: 538-215922-1401
Price: 0.64 GBP
Availability: InStock

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Mouser No:

538-215922-1401

Mfr. No:

215922-1401

Mfr.:

Molex

Description:

Headers & Wire Housings Plug Housing Dual Row 14 Circuits

Datasheet:

215922-1401 Datasheet

ECAD Model:

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More Information

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In Stock: 9,572

Stock:: 9,572

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On Order:: 3,200
Factory Lead Time:: 9

Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (GBP)

Qty.	Unit Price	Ext. Price
	£0.643	£0.64
	£0.545	£5.45
	£0.523	£13.08
	£0.489	£48.90
	£0.445	£111.25
	£0.40	£200.00
	£0.365	£365.00
	£0.342	£855.00
	£0.326	£1,630.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Wire Housings
Number of Positions:	14 Position
Pitch:	3 mm (0.118 in)
Number of Rows:	2 Row
Mounting Style:	Panel Mount
Termination Style:	Wire Wrap
Mounting Angle:	Straight
Series:	215922
Tradename:	Micro-Fit+
Packaging:	Bulk
Brand:	Molex
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Flammability Rating:	UL 94 V-0
Housing Colour:	Black
Housing Gender:	Plug
Housing Material:	Polyamide (PA)
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	6400
Subcategory:	Headers & Wire Housings
Part # Aliases:	2159221401 02159221401

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Datasheet

215922-1401 Datasheet

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STP File (Zip)

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USHTS:: 8538906000
JPHTS:: 853890000
MXHTS:: 8538900100
BRHTS:: 85389090
ECCN:: EAR99

Micro-Fit+ Connectors

Molex Micro-Fit+ Connectors offer superior design options for flexibility and efficient assembly. The connectors offer a high current rating of up to 13.5A with a 3mm pitch and use the same amount of space that smaller connectors occupy. Features include a smaller PCB footprint, a reduced mating force of 40%, and an enhanced TPA design that provides stability and security for the terminals inside the receptacle. Molex Micro-Fit+ applications include consumer, telecommunication/networking, medical, sustainable energy, and automotive.