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A18841-07

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See Product Specifications

Mouser No:

739-A18841-07

Mfr. No:

A18841-07

Mfr.:

Laird Technologies

Description:

Thermal Interface Products Tflex SF4 1.75 229x229mm

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

A18841-07 Datasheet (PDF)

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Learn more about Laird Technologies A18841-07

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Laird Technologies
Product Category:	Thermal Interface Products
Delivery Restriction:	Mouser does not presently sell this product in your region.
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Silicone-Free Gap Filler
Package/Case:	Non-standard
Material:	Silicone
Thermal Conductivity:	4 W/m-K
Color:	Gray (Light Gray)
Minimum Operating Temperature:	- 65 C
Maximum Operating Temperature:	+ 150 C
Length:	229 mm
Width:	229 mm
Thickness:	1.75 mm
Tensile Strength:	30 psi
Flammability Rating:	UL 94 V-0
Series:	SF4
Packaging:	Bulk
Brand:	Laird Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Designed for:	Automotive Electronics, Datacom Systems
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Thermal Resistance:	0.07 C/W
Tradename:	Tflex

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Datasheet

A18841-07 Datasheet (PDF)

USHTS:: 3824999397
ECCN:: EAR99

Tflex SF4 Thermal Gap Fillers

Laird Technologies Tflex SF4 Thermal Gap Fillers are silicon-free and offer a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity. These gap fillers provide products with excellent deflection properties, providing minimal pressure on components during deflection. A minimal amount of pressure is required to reach the lowest possible thermal resistance. Laird Technologies Tflex SF4 Thermal Gap Fillers are designed for datacom systems, automotive electronics, optical modules, and cameras.

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.