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IME1G08D3EEBG-15EI

Name: Intelligent Memory IME1G08D3EEBG-15EI
Brand: Intelligent Memory
SKU: 822-IME1G08D3EBG15EI
Price: 6.18 GBP
Availability: OutOfStock

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Mouser No:

822-IME1G08D3EBG15EI

Mfr. No:

IME1G08D3EEBG-15EI

Mfr.:

Intelligent Memory

Description:

DRAM ECC DDR3, 1Gb, 1.5V, 128Mx8, 667MHz (1333Mbps), -40C to +95C, FBGA-78

Datasheet:

IME1G08D3EEBG-15EI Datasheet

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Learn more about Intelligent Memory IME1G08D3EEBG-15EI

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Stock:: Non-Stocked

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Factory Lead Time:: 26 Weeks Estimated factory production time.

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Pricing (GBP)

Qty.	Unit Price	Ext. Price
	£6.18	£6.18
	£5.83	£1,410.86

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Intelligent Memory
Product Category:	DRAM
RoHS:
Type:	SDRAM - DDR3
Memory Size:	1 Gbit
Data Bus Width:	8 bit
Maximum Clock Frequency:	667 MHz
Package/Case:	FBGA-78
Organisation:	128 M x 8
Access Time:	20 ns
Supply Voltage - Min:	1.425 V
Supply Voltage - Max:	1.575 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 95 C
Series:	IME1G08D3
Packaging:	Tray
Brand:	Intelligent Memory
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Product Type:	DRAM
Factory Pack Quantity:	242
Subcategory:	Memory & Data Storage
Supply Current - Max:	220 mA
Unit Weight:	244 mg

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Datasheet

IME1G08D3EEBG-15EI Datasheet

CAHTS:: 8542320020
USHTS:: 8542320032
MXHTS:: 8542320299
ECCN:: EAR99

Double Data Rate 3 (DDR3) DRAM

Intelligent Memory Double Data Rate 3 (DDR3) DRAM provides 1Gb to 16Gb densities for commercial and industrial applications. These ICs support Off-Chip Driver (OCD) impedance and On-Die Termination (ODT). The Intelligent Memory DDR3 DRAM features write leveling, programmable burst lengths, and CAS latency in FBGA-78 and FBGA-96 packages.

Dynamic Random Access Memory (DRAM)

Intelligent Memory Dynamic Random Access Memory (DRAM) includes a full range of JEDEC-compliant DRAMs and ECC DRAMs (SDRAM, DDR, DDR2, DDR3, DDR4, LPDDR4). From an application's point of view, these components work like a monolithic device. The DRAM devices allow for maximum levels of memory density without altering existing board layouts or designs.