S41X083000XP

CTS Electronic Components
774-S41X083000XP
S41X083000XP

Mfr.:

Description:
Resistor Networks & Arrays 0 Ohms 4 resistors

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
13 Weeks Estimated factory production time.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 10000)

Pricing (GBP)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
£0.183 £0.18
£0.158 £1.58
£0.115 £2.88
£0.061 £6.10
£0.048 £12.00
£0.037 £18.50
£0.032 £32.00
£0.026 £130.00
Full Reel (Order in multiples of 10000)
£0.024 £240.00
† A MouseReel™ fee of £3.50 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
CTS
Product Category: Resistor Networks & Arrays
RoHS:  
Reel
Cut Tape
MouseReel
S4x
Arrays
SMD/SMT
0 Ohms
Isolated
4 Resistor
8 Pin
200 PPM / C
- 55 C
+ 125 C
0803 (0201 metric)
2 mm
1 mm
0.35 mm
Brand: CTS Electronic Components
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: JP
Power per Element: 31 mW
Product Type: Resistor Networks & Arrays
Factory Pack Quantity: 10000
Subcategory: Resistors
Type: Sulfur Resistant Chip Resistor Array
Voltage Rating: 50 V
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Attributes selected: 0

Datasheet

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CAHTS:
8533210000
USHTS:
8533210020
JPHTS:
853321000
KRHTS:
8533219000
TARIC:
8533210000
MXHTS:
8533210100
BRHTS:
85332120
ECCN:
EAR99

S4x Sulfur Resistant Chip Resistor Arrays

CTS Electronic Components S4x Series Sulfur Resistant Chip Resistor Arrays are specifically designed to resist sulfurization that occurs in high-sulfur environments. The standard chip and chip array resistor products get corroded in high sulfurous environments and a layer of silver sulfide (Ag2S) is formed. This sulfide chemical can crack the ceramic substrate and create a very high resistance path between resistor connections to function as an open circuit connection. The design of S4x Series Chip Resistor Arrays adds a protective layer between the silver (Ag) conductor and the final epoxy cover coat layer. This barrier prevents the fusion of sulfur into the silver interface avoiding sulfide growth.

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