TGP40000SF-0.060-01-0606-NA

Bergquist Company
951-TGP400SF.0600166
TGP40000SF-0.060-01-0606-NA

Mfr.:

Description:
Thermal Interface Products GAP PAD, Sil-Free, 40W/m-K, 6 x 6" Sheet, Tacky Pad, 0.060" Thickness, Thermexit

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
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More Information
Learn more about Bergquist Company TGP40000SF-0.060-01-0606-NA

In Stock: 8

Stock:
8
Can Dispatch Immediately
On Order:
10
Factory Lead Time:
7
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:
This Product Ships FREE

Pricing (GBP)

Qty. Unit Price
Ext. Price
£169.52 £169.52
£152.07 £1,520.70
£142.83 £4,284.90
£139.83 £6,991.50

Product Attribute Attribute Value Select Attribute
Bergquist Company
Product Category: Thermal Interface Products
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone-Free Polymer
40 W/m-K
Black
- 40 C
+ 150 C
152.4 mm
152.4 mm
1.524 mm
TGP 40000SF
Brand: Bergquist Company
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Designed for: Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
Height: 6 in
Product Type: Thermal Interface Products
Size: 6 in x 6 in
Factory Pack Quantity: 10
Subcategory: Thermal Management
Tradename: GAP PAD / Thermexit
Part # Aliases: TGP40000SF-0.060-01-0606 2987873
Unit Weight: 60 g
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Attributes selected: 0

CAHTS:
3920990000
USHTS:
3920995000
ECCN:
EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.

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