ATS012012011-SF-2J

Advanced Thermal Solutions
984-ATS012012011SF2J
ATS012012011-SF-2J

Mfr.:

Description:
Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 12x12x11mm

Datasheet:
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Learn more about Advanced Thermal Solutions ATS012012011-SF-2J

In Stock: 79

Stock:
79 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£3.09 £3.09
£2.90 £29.00
£2.82 £56.40
£2.67 £133.50
£2.51 £251.00
£2.35 £470.00
£2.27 £1,135.00
£2.14 £2,140.00

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Heat Sinks
RoHS:  
Heat Sinks
BGA
PCB
Aluminum
Straight Fin
21.39 C/W
12 mm
12 mm
11 mm
Brand: Advanced Thermal Solutions
Color: Black
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Packaging: Bulk
Product Type: Heat Sinks
Series: BGA High Aspect Ratio
Factory Pack Quantity: 100
Subcategory: Heat Sinks
Tradename: Value-Line Platform
Type: Component
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Attributes selected: 0

Datasheet

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CAHTS:
8542900000
USHTS:
8542900000
JPHTS:
854290000
TARIC:
8542900000
MXHTS:
8542900100
ECCN:
EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera®, AMD, Freescale, Intel®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.

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